Modeling study of thermosonic flip chip bonding processFULIANG WANG; YUN CHEN.Microelectronics and reliability. 2012, Vol 52, Num 11, pp 2749-2755, issn 0026-2714, 7 p.Article

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip InterconnectionLEE, Kiwon; KIM, Hyoung-Joon; YIM, Myung-Jin et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 241-247, issn 1521-334X, 7 p.Article

Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive pasteCHUANG, Cheng-Li; CHEN, Wei-How; LI, Hsun-Tien et al.Microelectronic engineering. 2010, Vol 87, Num 11, pp 2146-2157, issn 0167-9317, 12 p.Article

The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensorGAUL, H; SHAH, A; MAYER, M et al.Microelectronic engineering. 2010, Vol 87, Num 4, pp 537-542, issn 0167-9317, 6 p.Article

Ultrasonic bonding: Understanding how process parameters determine the strength of Au-Al bondsMAYER, Michael; SCHWIZER, Jürg.SPIE proceedings series. 2002, pp 626-631, isbn 0-930815-66-1, 6 p.Conference Paper

Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bondingMAEDA, Masakatsu; SATO, Takaaki; INOUE, Naoto et al.Microelectronics and reliability. 2011, Vol 51, Num 1, pp 130-136, issn 0026-2714, 7 p.Article

Power and Interface Features of Thermosonic Flip-Chip BondingJUNHUI LI; LEI HAN; JUE ZHONG et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 3, pp 442-446, issn 1521-3323, 5 p.Article

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress AnalysisYONG LIU; IRVING, Scott; LUK, Timwah et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 61-71, issn 1521-334X, 11 p.Article

High-frequency wirebonding: Its impact on bonding machine parameters and MCM substrate bondabilityCHARLES, H. K; LEHTONEN, S. J; MACH, K. J et al.SPIE proceedings series. 2001, pp 350-360, isbn 0-8194-4317-4Conference Paper

Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding MethodLEE, Sang-Hoon; SUK, Kyung-Lim; LEE, Kiwon et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 11-12, pp 2108-2114, issn 2156-3950, 7 p.Article

A new ultrasonic precise bonding method with ultrasound propagation feedback for polymer MEMSYIBO SUN; YI LUO; XIAODONG WANG et al.Microelectronic engineering. 2011, Vol 88, Num 10, pp 3049-3053, issn 0167-9317, 5 p.Article

Ultrasonic Vibration at Thermosonic Flip-Chip Bonding InterfaceFULIANG WANG; YUN CHEN; LEI HAN et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 5-6, pp 852-858, issn 2156-3950, 7 p.Article

Microfabrication processes on cylindrical substrates -Part II: Lithography and connectionsSNOW, Sean; JACOBSEN, Stephen C.Microelectronic engineering. 2007, Vol 84, Num 1, pp 11-20, issn 0167-9317, 10 p.Article

A solder-free interconnect approach for integrating millimeter wave high-power devices with planar circuitryCHOUDHURY, Debabani; LAWYER, Phillip H; FOSCHAAR, James A et al.IEEE transactions on advanced packaging. 2003, Vol 26, Num 4, pp 417-424, issn 1521-3323, 8 p.Article

High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique : Best-of-Session Papers from the 60th Electronic Components and Technology ConferenceLEE, Kiwon; SAARINEN, Ilkka J; PYKARI, Lasse et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 11-12, pp 1901-1907, issn 2156-3950, 7 p.Article

Ultrasonic bonding for thermoplastic microfluidic devices without energy directorYI LUO; ZONGBO ZHANG; XIAODONG WANG et al.Microelectronic engineering. 2010, Vol 87, Num 11, pp 2429-2436, issn 0167-9317, 8 p.Article

Reliable metallic tape connection on CIGS solar cells by ultrasonic bondingTAO XU; VALENTIN, Orlando; LUECHINGER, Christoph et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7771, issn 0277-786X, isbn 978-0-8194-8267-9, 77710R.1-77710R.12Conference Paper

Low-Stress Thermosonic Copper Ball BondingSHAH, Aashish; MAYER, Michael; NORMAN ZHOU, Y et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 176-184, issn 1521-334X, 9 p.Article

Ultrasonic Bonding for MEMS Sealing and Packaging : Packaging for micro/nano-scale systemsKIM, Jongbaeg; JEONG, Bongwon; MU CHIAO et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 461-467, issn 1521-3323, 7 p.Article

Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature riseYONG DING; KIM, Jang-Kyo.Microelectronics and reliability. 2008, Vol 48, Num 1, pp 149-157, issn 0026-2714, 9 p.Article

Effects of bonding force on contact pressure and frictional energy in wire bondingYONG DING; KIM, Jang-Kyo; PIN TONG et al.Microelectronics and reliability. 2006, Vol 46, Num 7, pp 1101-1112, issn 0026-2714, 12 p.Article

Real-time quality evaluation of wire bonding using input impedanceLING, Shih-Fu; DONG ZHANG; YI, Sung et al.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 4, pp 280-284, issn 1521-334X, 5 p.Article

Ultra-high-density interconnection technology of 3-dimensional packagingTAKAHASHI, Kenji; UMEMOTO, Mitsuo; TANIDA, Kazumasa et al.SPIE proceedings series. 2002, pp 354-359, isbn 0-930815-66-1, 6 p.Conference Paper

In situ ultrasonic stress microsensor for second bond characterizationSCHWIZER, Jürg; MAYER, Michael; BRAND, Oliver et al.SPIE proceedings series. 2001, pp 338-343, isbn 0-8194-4317-4Conference Paper

Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bondingSEPPÄNEN, Henri; KURPPA, Risto; MERILÄINEN, Antti et al.Microelectronic engineering. 2013, Vol 104, pp 114-119, issn 0167-9317, 6 p.Article